12" Metal Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron, 1/box, DIA-M015-12-PSA Abrasive Size:15 µm 6-inch SiC Abrasive Wafering Blade

Name: 12" Metal Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron, 1/box, DIA-M015-12-PSA Abrasive Size:15 µm 6-inch SiC Abrasive Wafering Blade
Brand: idigit.com.br
SKU: 47232909578
Price: 353.92 USD
Availability: InStock
Rating: 4.486000000000001 (30 reviews)

SKU: 47232909578

4.5

USD353.92 USD382.92

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Ships within 48 hours · Estimated delivery Jul 28 - Aug 2

Description

6-inch SiC Abrasive Wafering Blade (0

7-inch General purpose diamond/CBN Wafering Blade

Please note: for orders greater than 32 oz of this product

10 micron Diamond Lapping Film (plain-backed) (3/pkg)

EPOCAST Epoxy Hardener available in 8 0z

12" Metal Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron, 1/box, DIA-M015-12-PSA Abrasive Size:15 µm 6-inch SiC Abrasive Wafering Blade12 inch 15 micron metal bonded Diamond Abrasive Grinding Disk with PSA backing (each)

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